Twitter        

PLP Scholars Class

PLP Scholars are a select group of students who participate in enriched leadership development experiences throughout their four years at Colorado State University. In addition to the traditional three-year President's Leadership Program, PLP Scholars will attend small group discussions with the CSU President and top faculty, meet nationally-renowned leaders, receive $2,000 in funding for international service experiences, and complete discover/artistry projects in their field of study. (For a glimpse into the PLP Scholar experience, click here.)
 
PLP Scholars will be personally advised by staff in the President's Leadership Program and will participate in a Peer Mentor Program. Every year, PLP Scholars will coordinate and implement a service project of their choice within the Fort Collins community.
 
 
QUALIFICATIONS:
To apply, students must be high school seniors identified as finalists for one of the following scholarships:  Anschutz, Boettcher, Daniels, Monfort, Puksta, National Achievement, National Hispanic Recognition, or National Merit.
 
Additional requirements include significant participation in high school leadership and service activities, and a commitment to leadership, service, and scholarship in college. Final selection will be based upon receiving one of the aforementioned scholarships. Admission to the program will be on a rolling basis until the five PLP Scholars are selected and confirmed. As such, you are encouraged to complete your application as soon as possible.
 
TO APPLY:
Please utilize the following links to access the necessary materials to apply to the PLP Scholars Class:
Please note: Students who apply to the PLP Scholars Class do not need to apply separately to the President’s Leadership Program. In the case that you are not selected as a PLP Scholar, this application will be forwarded to the PLP selection committee for consideration.
 
For Further Information Please Contact: Deanna Leone, President’s Leadership Program, (970) 491-2181 or via email.